Semiconductor component having stacked, encapsulated dice and method of fabrication

ABSTRACT

A semiconductor component includes a substrate and multiple stacked, encapsulated semiconductor dice on the substrate. A first die is back bonded to the substrate and encapsulated in a first encapsulant, and a second die is back bonded to the first encapsulant. The first encapsulant has a planar surface for attaching the second die, and can also include locking features for the second die. The component also includes a second encapsulant encapsulating the second die and forming a protective body for the component. A method for fabricating the component includes the steps of attaching the first die to the substrate, forming the first encapsulant on the first die, attaching the second die to the first encapsulant, and forming the second encapsulant on the second die.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a division of Ser. No. 10/862,102 filed Jun. 4,2004, U.S. Pat. No. 7,109,576, which is a division of Ser. No.10/436,584 filed May 12, 2003, U.S. Pat. No. 6,853,064 B2.

This application is related to Ser. No. 10/649,147 filed Aug. 27, 2003,U.S. Pat. No. 7,008,822.

FIELD OF THE INVENTION

This invention relates generally to semiconductor manufacture andpackaging. More particularly, this invention relates to a stacked dicesemiconductor component, to a method for fabricating the component, andto systems incorporating the component.

BACKGROUND OF THE INVENTION

Semiconductor manufacturers have developed components, such as packagesand BGA devices, which contain multiple semiconductor dice. For example,systems in a package (SIP) include multiple dice having differentconfigurations, such as a memory, a processing, or an applicationspecific configuration. The multiple dice provide increased integration,security and performance in a component.

Semiconductor manufacturers have also developed components such as chipscale packages, having a smaller outline and a higher input/outputcapability than conventional components. Chip scale components have aperipheral outline (footprint) that is about the same as that of thedice contained in the components. It would be advantageous for asemiconductor component to have multiple semiconductor dice but with achip scale outline.

One aspect of chip scale components, is that they are difficult tomanufacture with the reliability required in the industry. For example,some chip scale components include relatively complicated signaltransmission systems, which are difficult to manufacture, and prone tofailure. It would be advantageous for a multi-dice chip scale componentto have a reliable signal transmission system capable of volumemanufacture.

The present invention is directed to a semiconductor component havingmultiple dice, a chip scale outline, and a reliable signal transmissionsystem. In addition, the present invention is directed to a method forfabricating the component which uses conventional equipment, andproduces a reliable component. The present invention is also directed tosystems incorporating one or more of the components.

SUMMARY OF THE INVENTION

In accordance with the present invention, a semiconductor componenthaving stacked, encapsulated dice, a method for fabricating thecomponent, and systems incorporating the component are provided.

The component includes a substrate having terminal contacts on an outersurface, and interconnect contacts on an inner surface in electricalcommunication with the terminal contacts. The component also includes afirst semiconductor die back bonded to the inner surface of thesubstrate, a first encapsulant on the first die, and a secondsemiconductor die back bonded to the first encapsulant. The firstencapsulant has a planar surface for attaching the second die, and canalso include locking features for implementing attachment of the seconddie. The component also includes an internal signal transmission system,which comprises a plurality of interconnects bonded to the interconnectcontacts on the substrate and to die contacts on the circuits sides ofthe dice. In addition, the component includes a second encapsulantencapsulating the second die, the first encapsulant and theinterconnects.

An alternate embodiment component includes three or more stacked,encapsulated dice on a substrate. Another alternate embodiment componentincludes multiple stacks of stacked, encapsulated dice. Anotheralternate embodiment component includes a stack of dice having at leasttwo first dice back bonded to the substrate, and a second die stacked onand substantially covering the first dice.

A method for fabricating the component includes the steps of providingthe substrate, attaching the first die to the substrate, forming firstinterconnects between the first die and the substrate, and forming thefirst encapsulant on the first die and on the first interconnects. Themethod also includes the steps of attaching the second die to the firstencapsulant, forming second interconnects between the second die and thesubstrate, and forming the second encapsulant on the second die, on thesecond interconnects and on the first encapsulant.

The component can be used to construct various electrical systems suchas computer systems, camcorder systems, camera systems, cellulartelephone systems, and medical device systems.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is an enlarged schematic plan view of a semiconductor componentconstructed in accordance with the invention;

FIG. 1B is an enlarged schematic side elevation view of the component;

FIG. 1C is an enlarged schematic cross sectional view of the componenttaken along section line 1C-1C of FIG. 1A;

FIG. 1D is an enlarged schematic cross sectional view of the componenttaken along section line 1D-1D of FIG. 1C;

FIG. 1E is an enlarged schematic cross sectional view of the componenttaken along section line 1E-1E of FIG. 1C;

FIG. 1F is an enlarged schematic cross sectional view of the componenttaken along section line 1F-1F of FIG. 1C;

FIG. 1G is an enlarged schematic cross sectional view of the componenttaken along section line 1G-1G of FIG. 1C;

FIGS. 2A-2F are enlarged schematic cross sectional views illustratingsteps in a method for fabricating the component;

FIG. 3A is an enlarged schematic cross sectional view during thefabrication method, taken along section line 3A-3A of FIG. 2A;

FIG. 3B is an enlarged schematic cross sectional view during thefabrication method, taken along section line 3B-3B of FIG. 2B;

FIG. 3C is an enlarged schematic cross sectional view during thefabrication method, taken along section line 3C-3C of FIG. 2C;

FIG. 3D is an enlarged schematic cross sectional view during thefabrication method, taken along section line 3D-3D of FIG. 2D;

FIG. 3E is an enlarged schematic cross sectional view during thefabrication method, taken along section line 3E-3E of FIG. 2E;

FIG. 3F is an enlarged schematic cross sectional view during thefabrication method, taken along section line 3F-3F of FIG. 2F;

FIG. 4 is an enlarged schematic cross sectional view equivalent to FIG.1C of an alternate embodiment component;

FIG. 5 is an enlarged schematic cross sectional view equivalent to FIG.1C of an alternate embodiment component;

FIG. 6 is an enlarged schematic cross sectional view equivalent to FIG.1C of an alternate embodiment component;

FIG. 7 is an enlarged schematic cross sectional view equivalent to FIG.1C of an alternate embodiment component;

FIG. 8 is a schematic cross sectional view of a camcorder systemincorporating components constructed in accordance with the invention;

FIG. 9 is a schematic cross sectional view of a camera systemincorporating components constructed in accordance with the invention;

FIG. 10 is a schematic cross sectional view of a cellular phone systemincorporating components constructed in accordance with the invention;

FIG. 11 is a schematic cross sectional view of a medical device systemincorporating components constructed in accordance with the invention;and

FIG. 12 is a schematic cross sectional view of a computer systemincorporating components constructed in accordance with the invention.

All of the drawing Figures, particularly the cross sectional views, areschematic such that the elements contained therein are not to scale.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

As used herein, the term “semiconductor component” refers to anelectronic element that includes a semiconductor die. Exemplarysemiconductor components include semiconductor packages, semiconductormodules and BGA devices.

Referring to FIGS. 1A-1G, a semiconductor component 10 constructed inaccordance with the invention is illustrated. In the illustrativeembodiment, the component 10 is in the form of a chip scale package. Asshown in FIG. 1C, the component 10 includes a substrate 12, a first die14 bonded to the substrate 12, and a second die 16 stacked on the firstdie 14.

The first die 14 and the second die 16 comprise active semiconductordice having a desired electrical configuration. Also in the illustrativeembodiment, the first die 14 and the second die 16 have the sameperipheral outlines, but can have different peripheral outlines. By wayof example, each die 14, 16 can comprise a high speed digital logicdevice, such as a dynamic random access memory (DRAM), a static randomaccess memory (SRAM), a flash memory, a microprocessor, a digital signalprocessor (DSP), or an application specific integrated circuit (ASIC).In addition, each die 14, 16 can have the same electronic configurationor a different electronic configuration. Further, the dice 14, 16 can beconfigured and interconnected, such that the component 10 forms a systemin a package (SIP).

The component 10 also includes a first encapsulant 18 substantiallyencapsulating the first die 14, and a second encapsulant 20substantially encapsulating the second die 16. The first encapsulant 18and the second encapsulant 20 can comprise a curable polymer materialsuch as an epoxy, a silicone, a polyimide or a transfer molded underfillcompound (MUF). In addition, these polymer materials can include fillerssuch as silicates configured to reduce the coefficient of thermalexpansion (CTE) and adjust the viscosity of the polymer material. Thefirst encapsulant 18 and the second encapsulant 20 are preferably moldedusing a molding process to be hereinafter described.

As shown in FIG. 1C, the component 10 also includes a first adhesivelayer 36 which attaches the first die 14 to the substrate 12, and asecond adhesive layer 38 which attaches the second die 16 to the firstencapsulant 18. The first adhesive layer 36 and the second adhesivelayer 38 can comprise conventional die attach adhesives, such as acurable polymer such as epoxy, or a tape material such as a “KAPTON”tape, applied using techniques that are known in the art, such asdeposition though a nozzle, or applying of cut decals. The firstadhesive layer 36 and the second adhesive layer 38 can also comprise amolded material such as a molded underfill material.

The substrate 12 is configured as a support element for the dice 14, 16and the encapsulants 18, 20. The substrate 12 is also configured as aninterposer element, which includes a signal transmission system betweenthe dice 14, 16 and the outside world. In the illustrative embodiment,the substrate 12 comprises a glass filled polymer, such asbismaleimide-triazine (BT), or another circuit board material.Alternately, the substrate 12 can comprise an electrically insulatingplastic, ceramic or glass material.

Also in the illustrative embodiment, the substrate 12 is generallyrectangular shaped with opposing longitudinal edges 42 (FIG. 1D) andopposing lateral edges 44 (FIG. 1D). However, other polygonal shapessuch as square, triangular, pentagonal or circular can also be employed.The peripheral outline (footprint) of the component 10 and theperipheral outline of the substrate 12 are substantially the same. Asthe substrate 12 has a peripheral outline that is slightly larger than,but about the same size as the peripheral outlines (footprints) of thedice 14, 16, the component 10 can be considered a chip scale package(CSP).

As shown in FIG. 1C, the substrate 12 includes an array of electricallyconductive terminal contacts 22 configured for signal transmission toand from the component 10. In the illustrative embodiment, the terminalcontacts 22 comprise metal bumps or balls. However, the terminalcontacts 22 can also comprise pins, polymer bumps, spring contacts orany terminal contact known in the art. Also in the illustrativeembodiment, there are forty four terminal contacts 22, arranged in aball grid array (BGA) which includes four rows of eleven terminalcontacts 22 each. However, this arrangement is merely exemplary, and theterminal contacts 22 can be arranged in any area array, such as a fineball grid array (FBGA), an edge array, or a peripheral array, containingany desired number of terminal contacts 22.

Further, the terminal contacts 22 have outside diameters on the order ofabout 300 μm to 350 μm. This makes the terminal contacts 22 much largerin comparison to the other elements of the component 10. However, forillustrative purposes the terminal contacts 22 are shown as being aboutthe same size as other elements of the component 10.

As shown in FIG. 1D, the substrate 12 also includes a pattern of firstinterconnect contacts 24 configured for wire bonding to the first die14, and a pattern of second interconnect contacts 26 configured for wirebonding to the second die 16. In the illustrative embodiment, the secondinterconnect contacts 26 are arranged in two outside rows proximate tothe opposing longitudinal edges 42 of the substrate 12. The firstinterconnect contacts 24 are also arranged in two rows, but inside ofthe second interconnect contacts 26 and closer to the inner portion ofthe substrate 12. The first interconnect contacts 24 and the secondinterconnect contacts 26 can comprise a wire bondable metal such asaluminum or copper and can have any desired shape, such as square,rectangular or circular.

As shown in FIG. 1C, the substrate 12 also includes conductors 40 whichelectrically connect the interconnect contacts 24, 26 to the terminalcontacts 22 in a required circuit configuration. The conductors 40 canbe formed using techniques that are known in the art such as formingconductive traces on outside surfaces of the substrate 12, or on innerlevels of the substrate 12. In addition, the conductors 40 can includeconductive vias which interconnect different surfaces or levels of thesubstrate 12.

As shown in FIG. 1E, the component 10 also includes first wireinterconnects 28 wire bonded to the first interconnect contacts 24 onthe substrate 12, and to first die contacts 32 on the first die 14. Thefirst die contacts 32 can comprise bond pads, redistribution pads, orother wire bondable contacts in electrical communication with theintegrated circuits contained on the first die 14.

As shown in FIG. 1G, the component 10 also includes second wireinterconnects 30 wire bonded to the second interconnect contacts 26 onthe substrate 12, and to second die contacts 34 on the second die 16.The second die contacts 34 can comprise bond pads, redistribution pads,or other wire bondable contacts in electrical communication with theintegrated circuits contained on the second die 16.

In the illustrative embodiment, both the first die contacts 32 (FIG. 1E)and the second die contacts 34 (FIG. 1G) are edge arrays, located alonglongitudinal edges of the dice 14, 16. Similarly, the interconnectcontacts 24, 26 (FIG. 1D) on the substrate 12 are edge arrays locatedalong longitudinal edges 42 (FIG. 1D) of the substrate 12. As isapparent, this arrangement is merely exemplary, and other area arrays orpatterns, can be used for both the die contacts 32, 34 on the dice 14,16, and the interconnect contacts 24, 26 on the substrate 12. However,with any arrangement, the second interconnect contacts 26 on thesubstrate 12 must be accessible for wire bonding, following formation ofthe first encapsulant 18 on the first die 14.

As shown in FIG. 1F, the first encapsulant 18 includes a planar surface48 having a peripheral outline that is about the same size as, but isslightly larger than, the peripheral outline of the second die 16. Inaddition, the first encapsulant 18 has a peripheral outline that islarger than the first die 14, by an area sufficient to encapsulate thefirst die 14 and also to encapsulate the first wire interconnects 28.However, the first encapsulant 18 is inside the perimeter of the secondinterconnect contacts 26, and is shaped such that the secondinterconnect contacts 26 are not encapsulated by the first encapsulant18.

Further, the first encapsulant 18 can include one or more lockingfeatures 46 formed on the planar surface 48 thereof. The lockingfeatures 46 are configured to promote adhesion of the second adhesivelayer 38 to the first encapsulant 18, and to increase the adhesivebonding of the second die 16 to the first encapsulant 18. The lockingfeatures 46 can comprise molded features such as ridges, dimples,indentations, or grooves formed integrally with the first encapsulant18. The locking features 46 can also comprise a layer of material suchas an adhesion layer or a primer layer. As will be further explained,the first encapsulant 18 must be formed such that the secondinterconnect contacts 26 on the substrate 12 are not contaminated withencapsulating material, and remain accessible for wire bonding.

As shown in FIG. 1C, the second encapsulant 20 encapsulates the seconddie 16, encapsulates the first encapsulant 18, encapsulates the secondwire interconnects 30, and encapsulates portions of the surface of thesubstrate 12. The second encapsulant 20 also forms the bulk of theoutside of the component 10, and a protective body for the component 10.A peripheral outline of the second encapsulant 20 is large enough toencapsulate the second die and the second interconnect contacts 26. Inaddition, a peripheral outline of the second encapsulant 20 matches theperipheral outline of the substrate 12. Further, a thickness of thesecond encapsulant 20 is dependent on the height of the dice 14, 16 onthe substrate 12, and the loop height of the second wire interconnects30 on the substrate 12. The thickness of the second encapsulant 20 andthe substrate 12 together determines the thickness (profile) of thecomponent 10.

Referring to FIGS. 2A-2F and 3A-3F, steps in a method for fabricatingthe component 10 are illustrated. Initially, as shown in FIGS. 2A and3A, the substrate 12 can be provided. The substrate 12 preferablycomprises a lead frame, a strip, a panel, or a wafer of material onwhich multiple components 10 can be formed, and then singulated intoseparate components 10. For example, the substrate 12 can be containedon an organic lead frame configured for use with conventional die attachequipment, molding equipment and wire bonding equipment used insemiconductor manufacture and packaging.

With an organic lead frame, the substrate 12 can comprise an organicpolymer resin reinforced with glass fibers. Suitable materials includebismaleimide-triazine (BT), epoxy resins (e.g., “FR-4” and “FR-5”), andpolyimide resins. These materials can be formed with a desiredthickness, and then punched, machined, or otherwise formed with arequired peripheral configuration, and with required features. Inaddition, the substrate 12 can be constructed from a commerciallyproduced bi-material core, such as a copper clad bismaleimide-triazine(BT) core.

The substrate 12 can be provided with the first interconnect contacts 24and the second interconnect contacts 26 formed in a requiredconfiguration on an inner surface 50 thereof. In addition, the substrate12 can be provided with the conductors 40 (FIG. 1C) in a requiredconfiguration, and with bonding sites (not shown) for the terminalcontacts 22 on an outer surface 52 thereof in electrical communicationwith the interconnect contacts 26.

As shown in FIGS. 2B and 3B, the first die 14 can be bonded to thesubstrate 12 by attaching the back side of the first die 14 to theadhesive layer 36, and by attaching the adhesive layer 36 to the innersurface 50 of the substrate 12. Conventional die attach equipment can beused to attach the adhesive layer 36 and to back bond the first die 14to the substrate 12. In addition, the first die 14 can be wire bonded tothe substrate 12 by bonding the first wire interconnects 28 to the firstdie contacts 32 on the first die 14, and to the first interconnectcontacts 24 on the substrate 12. Conventional wire bonding equipment,such as a wire bonding tool, can be utilized to wire bond the first die14 to the substrate 12.

As also shown in FIG. 2B, the terminal contacts 22 can be formed on theouter surface 52 of the substrate 12. However, the terminal contactforming step need not be performed at this point of the method, but canbe delayed until just prior to the singulation step to follow. Theterminal contacts 22 can be formed by reflow bonding pre-fabricatedsolder balls to bonding sites (not shown) on the outer surface 52 of thesubstrate in electrical communication with the interconnect contacts 24,26.

The terminal contacts 22 can also be formed by electrolytic depositionor by electroless deposition of solder bumps to the bonding sites. Aball bumper such as one manufactured by Pac Tech Packaging Technologiesof Falkensee, Germany can also be used to form the terminal contacts 22.The terminal contacts 22 can also be formed using a conventional wirebonder apparatus adapted to form a ball bond, and then to sever theattached wire. The terminal contacts 22 can also comprise conductivepolymer bumps formed using a suitable deposition and curing process. Asanother alternative, the terminal contacts 22 can comprise pins orcolumns formed using a soldering, welding or brazing process.

Next, as shown in FIGS. 2C and 3C, the first encapsulant 18 can beformed on the substrate 12 to encapsulate the first die 14, the wirebonded first wire interconnects 28 and inner portions of the innersurface 50 of the substrate 12. A thickness of the first encapsulant 18can be selected as required, with a minimum thickness being greater thanthe loop height of the first wire interconnects 28. In the illustrativeembodiment the first encapsulant 18 is formed using a transfer moldingprocess. In general, transfer molding is an automated form ofcompression molding in which a preform of a plastic material is forcedfrom a pot into a heated mold cavity.

To perform the transfer molding process, a transfer molding apparatus 64having a mold tooling fixture 54 with a mold cavity 58 and a direct gate56 is provided. For simplicity the mold tooling fixture 54 isillustrated as being in contact with only the inner surface 50 of thesubstrate 12. However, in actual practice the mold tooling fixture 54can includes a mating structure that contacts the outer surface 52 ofthe substrate 12.

The transfer molding apparatus 64 is configured to transfer a viscousplastic preform, such as a “NOVOLAC” based epoxy encapsulant, throughthe direct gate 56 and into the mold cavity 58. The direct gate 56 isconfigured to form the first encapsulant 18 without contaminating thesecond interconnect contacts 26 with the viscous encapsulant. The moldcavity 58 is configured to form the first encapsulant 18 with the planarsurface 48 (FIG. 3C) for mounting the second die 16. The mold cavity 58can also include structures, such as recesses or protrusions, configuredto mold the locking features 46 (FIG. 3C) in the planar surface 48 (FIG.3C) of the first encapsulant 18. Following transfer molding, theencapsulant can be cured and at least partially hardened, usingtechniques that are known in the art, such as oven curing.

Rather than transfer molding, the first encapsulant 18 can be formed bydeposition of a viscous plastic using a conventional depositionapparatus, such as a material dispensing system having a computercontrolled nozzle. One suitable system is manufactured by Asymtek ofCarlsbad, Calif.

The first encapsulant 18 can also be formed using an injection moldingprocess. With injection molding, a liquefied plastic is injected into amold cavity in a manner similar to the above described transfer moldingprocess.

The first encapsulant 18 can also comprise a laser imageable materialpatterned using a stereo lithography, or laser imaging process. In thiscase, the first encapsulant 18 can comprise a laser imageable material,such as a Cibatool SL 5530 resin manufactured by Ciba SpecialtyChemicals Corporation. A stereo lithography system for performing theprocess is available from 3D Systems, Inc. of Valencia, Calif.

Next, as shown in FIGS. 2D and 3D, the second die 16 can be bonded tothe planar surface 48 (FIG. 3C) of the first encapsulant 18. The seconddie 16 can be bonded to the first encapsulant 18 by attaching the backside of the second die 16 to the adhesive layer 38, and by attaching theadhesive layer 38 to the planar surface 48 (FIG. 3C) of the firstencapsulant 18. Conventional die attach equipment can be used to attachthe adhesive layer 38 and to back bond the second die 16 to the firstencapsulant 18.

As also shown in FIGS. 2D and 3D, the second die 16 can be wire bondedto the substrate 12 by bonding the second wire interconnects 30 to thesecond die contacts 34 on the second die 16, and to the secondinterconnect contacts 26 on the substrate 12. Conventional wire bondingequipment, such as a wire bonding tool, can be utilized to wire bond thesecond die 16 to the substrate 12. In addition, the first encapsulant 18must be dimensioned to allow access to the second interconnect contacts26 by the wire bonding tool.

Next, as shown in FIGS. 2E and 3E, the second encapsulant 20 can beformed to encapsulate the second die 16, the wire bonded second wireinterconnects 30, and outer portions of the inner surface 50 of thesubstrate 12. A thickness of the second encapsulant 20 can be selectedas required, with a minimum thickness being greater than the loop heightof the wires 30. The second encapsulant 20 can be formed using atransfer molding process substantially as previously described for thefirst encapsulant 18. Alternately, the second encapsulant can be formedby viscous deposition, by injection molding, or by stereo lithography,substantially as previously described for the first encapsulant 18.

Next, as shown in FIGS. 2F and 3F, a singulating step can be performedto singulate the component 10 from the lead frame. The singulating stepcan be performed using techniques that are known in the art such assawing, shearing or punching.

Referring to FIG. 4, an alternate embodiment three dice component 10A isconstructed substantially as previously described for component 10 (FIG.1C) but includes three dice in a single stack. The component 10Aincludes a substrate 12A having terminal contacts 22A, and a first die14A back bonded and wire bonded to the substrate 12A. In addition, aplurality of first wire interconnects 28A are wire bonded to firstinterconnect contacts 24A on the substrate 12A, and to correspondingfirst die contacts 32A on the first die 14A. Further, a firstencapsulant 18A encapsulates the first die 14A and the first wireinterconnects 28A.

The component 10A also includes a second die 16A back bonded to thefirst encapsulant 18A and wire bonded to the substrate 12A,substantially as previously described for the second die 16 (FIG. 1C).In addition, a plurality of second wire interconnects 30A are wirebonded to second interconnect contacts 26A on the substrate 12A, and tocorresponding second die contacts 34A on the second die 16A. Further, asecond encapsulant 20A encapsulates the second die 16A, the second wireinterconnects 30A and the first encapsulant 18A.

The component 10A also includes a third die 17A back bonded to thesecond encapsulant 20A and wire bonded to the substrate 12A,substantially as previously described for the second die 16 (FIG. 1C).In addition, a plurality of third wire interconnects 31A are wire bondedto third interconnect contacts 27A on the substrate 12A, and tocorresponding third die contacts 35A on the third die 17A. Further, athird encapsulant 21A encapsulates the third die 17A, the third wireinterconnects 31A and the second encapsulant 21A. Alternately, thecomponent 10A can be constructed with a stack of any desired number ofdice (e.g., four, five, six), and can be configured as a system in apackage (SIP).

Referring to FIG. 5, an alternate embodiment four dice component 10B isconstructed substantially as previously described for component 10 (FIG.1C), but includes four dice in two stacks 60B, 62B of two dice each. Thecomponent 10B includes a substrate 12B having terminal contacts 22B,substantially as previously described for substrate 12 (FIG. 1C) andterminal contacts 22 (FIG. 1C).

The component 10B also includes a first die stack 60B and a second diestack 62B. The first die stack 60B includes a first die 14B back bondedand wire bonded to the substrate 12B, and a first encapsulant 18Bencapsulating the first die 14B. The second die stack 62B includes afirst die 14B back bonded and wire bonded to the substrate 12B, and afirst encapsulant 18B encapsulating the first die 14B. Both the firstdie stack 60B, and the second die stack 62B include a second die 16Bback bonded to the first encapsulant 18B, and wire bonded to thesubstrate 12B. The component 10B also includes a second encapsulant 20Bwhich encapsulates both die stacks 60A, 60B. The component 10B caninclude any number of die stacks, and can be configured as a multi chipmodule.

Referring to FIG. 6, an alternate embodiment component 10C includes asubstrate 12C, a first die 14C back bonded to the substrate 12C, and afirst encapsulant 18C encapsulating the first die 14C. The component 10Calso includes a second die 16C back bonded to the first encapsulant 18C,and a second encapsulant 20C encapsulating the second die 16C and thefirst encapsulant 18C. In addition, the component 10C includes tapeinterconnects 76C bonded to first die contacts 32C on the first die 14C,and to first interconnect contacts 24C on the substrate 12C. Further,the component 10C includes tape interconnects 78C bonded to second diecontacts 34C on the second die 16C and to second interconnect contacts26C on the substrate 12C. The tape interconnects 76C, 78C can comprise aTAB tape, such as ASMAT manufactured by Nitto Denko of Japan. Inaddition, the tape interconnects 76C, 78C can be bonded to the dice 14C,16C and the substrate 12C using conventional TAB (tape automatedbonding) techniques, such as thermode bonding. As with the wireinterconnects 28, 30 (FIG. 1C), the tape interconnects 76C areencapsulated in the first encapsulant 18C, and the tape interconnects78C are encapsulated in the second encapsulant 20C.

Referring to FIG. 7, an alternate embodiment component 10D isillustrated. The component 10D includes three dice in two stacks, butwith one of the stacks having a pair of dice. More particularly, thecomponent 10D includes a substrate 12D, a pair of first dice 14D backbonded and wire bonded to the substrate 12D, and a first encapsulant 18Dencapsulating the pair of first dice 14D. The component 10D alsoincludes first wire interconnects 28D wire bonded to the pair of firstdice 14D, and to first interconnect contacts 24D on the substrate 12D.The first wire interconnects 28D are encapsulated by the firstencapsulant 18D. The first dice 14D have substantially matchingperipheral outlines and have a space 80D therebetween for some of thewire interconnects 28D, which is filled by the first encapsulant 18D.The component 10D also includes a second die 16D back bonded to thefirst encapsulant 18D and wire bonded to the substrate 12D, and a secondencapsulant 20D encapsulating the second die 16D and the firstencapsulant 18D. The second die 16D has a peripheral outline which islarger than the combined peripheral outlines of the pair of first dice14D and the space therebetween. The component 10D also includes secondwire interconnects 30D wire bonded to the second die 16D and to secondinterconnect contacts 26D on the substrate 12D. The second wireinterconnects 30D are encapsulated in the second encapsulant 20D.

Referring to FIG. 8, a digital camcorder system 68 includes one or morecomponents 10, which can be mounted in a suitable manner, and configuredto perform a desired circuit function in the camcorder system 68.

Referring to FIG. 9, a camera system 70 includes one or more components10, which can be mounted in a suitable manner, and configured to performa desired circuit function in the camera system 70.

Referring to FIG. 10, a cellular phone system 72 includes one or morecomponents 10, which can be mounted in a suitable manner, and configuredto perform a desired circuit function in the cellular phone system 72.

Referring to FIG. 11, a medical device system 74 includes one or morecomponents 10, which can be mounted in a suitable manner, and configuredto perform a desired circuit function in the medical device system 74.

Referring to FIG. 12, a computer system 66 includes one or morecomponents 10, which can be mounted to the computer system 66 in asuitable manner. In addition, the components 10 can be configured toperform a desired function in the computer system 66 such as memory,storage or micro processing.

Thus the invention provides an improved semiconductor component havingstacked, encapsulated dice, a method for fabricating the component, andsystems incorporating the component. While the invention has beendescribed with reference to certain preferred embodiments, as will beapparent to those skilled in the art, certain changes and modificationscan be made without departing from the scope of the invention as definedby the following claims.

1. A semiconductor component comprising: a substrate comprising aplurality of interconnect contacts and a plurality of terminal contactsin electrical communication with the interconnect contacts; a first dieback bonded to the substrate, electrically connected to the interconnectcontacts; a plurality of first interconnects bonded to the first die andthe interconnect contacts; a first encapsulant encapsulating the firstdie and the first interconnects; a second die back bonded to the firstencapsulant, electrically connected to the interconnect contacts; aplurality of second interconnects bonded to the second die and theinterconnect contacts; a second encapsulant encapsulating the seconddie, the first interconnects, and the first encapsulant; a third dieback bonded to the second encapsulant, electrically connected to theinterconnect contacts; a plurality of third interconnects bonded to thethird die and the interconnect contacts; and a third encapsulantencapsulating the third die, the third interconnects and the secondencapsulant.
 2. The semiconductor component of claim 1 wherein the firstencapsulant comprises at least one locking feature configured toincrease adhesive bonding of the second die to the first encapsulant. 3.The semiconductor component of claim 1 wherein the terminal contactscomprise a ball grid array, and the substrate and the third encapsulanthave a chip scale outline.
 4. The semiconductor component of claim 3wherein the first interconnects, the second interconnects and the thirdinterconnects comprise wire bonded wires.
 5. The semiconductor componentof claim 3 wherein the first interconnects, the second interconnects andthe third interconnects comprise TAB bonded tape.
 6. A semiconductorcomponent comprising: a substrate comprising a plurality of interconnectcontacts and a plurality of terminal contacts in electricalcommunication with the interconnect contacts; a first die back bonded tothe substrate, electrically connected to the interconnect contacts; afirst encapsulant on the substrate encapsulating the first die andhaving at least one locking feature on a surface thereof; a plurality offirst interconnects bonded to the first die and the interconnectcontacts and encapsulated in the first encapsulant; a second die backbonded to the first encapsulant, electrically connected to theinterconnect contacts and encapsulated in a second encapsulant, thelocking feature configured to increase adhesive bonding of the seconddie to the first encapsulant; a plurality of second interconnects bondedto the second die and the interconnect contacts and encapsulated in thesecond encapsulant; a third die back bonded to the second encapsulant,electrically connected to the interconnect contacts; and a thirdencapsulant encapsulating the third die and the second encapsulant. 7.The component of claim 6 wherein the second encapsulant includes atleast one second locking feature configured to increase adhesive bondingof the third die to the second encapsulant.
 8. The component of claim 6wherein the locking feature comprises a molded feature in the firstencapsulant.
 9. The component of claim 6 wherein the locking featurecomprises a layer of material.